[Show Name] NEPCON JAPAN 2019 – 48th Electronics R&D, Manufacturing and Packaging Technology Expo
[Dates] January 16(Wed)-18(Fri), 2019 10:00-18:00 (last day until 17:00)
[Venue] Tokyo Big Sight Japan
[Organizer] Reed Exhibitions Japan Ltd.
[PARMI Japan Booth Number] E16-20
PARMI Co., Ltd. is going to participate in the ‘NEPCON JAPAN 2019’, Asia’s leading exhibition featuring all kinds of equipment, materials and technologies for electronics manufacturing and SMT.
In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), and demonstrate excellent technology to its customers by operating its equipment directly on the spot.
PARMI’s booth will be located at E16-20.