[Show Name] Nepcon Japan 2022
[Dates] January 19(Wed)-21(Fri), 2022 09:00-18:00 (last day until 16:00)
[Venue] Tokyo Big Sight, Japan
[Organizer] Reed Exhibitions Japan Ltd.
[Booth Number] 19-2

PARMI Japan is going to participate in the ‘Nepcon Japan 2022’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology.

In order to show the reliability and accuracy of the machine, PARMI Japan will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed DSI(Double Side Inspection with the internal flipper) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at 19-2.