[Show name] IPC APEX EXPO 2026
[Dates] March 17(Tue) – 19(Thu), 2026
[Venue] Anaheim Convention Center, USA
[Organizer] Global Electronics Association
[PARMI USA Booth Number] Hall C-D #2131

PARMI is going to participate in IPC APEX EXPO 2026, one of the world’s leading exhibitions for electronics manufacturing and packaging technologies. The event brings together global experts from the PCB and electronics manufacturing industries, providing opportunities to explore the latest technologies, industry trends, and global networking.

At this exhibition, PARMI will showcase its key inspection systems to demonstrate the reliability and accuracy of its products. Through live equipment demonstrations at the booth, the company plans to present its advanced technologies and solutions directly to customers.

• SigmaX : 3D SPI
• Xceed II : Next generation 3D AOI
• Xceed DSI : Double Side Inspection 3D AOI
• PCI 100 DSI : Conformal Coating Inspection 3D AOI
• INTELLION SiP: SiP Inspection 3D AOI
• PRECION: Wire Bonding 2D/3D Inspection

PARMI’s Booth will be located in Hall C-D #2131.