[Show name] SMART SMT PCB ASSEMBLY 2026
[Dates] April 1(Wed) – 3(Fri), 2026
[Venue] Suwon Convention Center, Korea
[Organizer] J. Expo
[Booth Number] I112

PARMI is going to participate in ‘SMART SMT PCB ASSEMBLY 2026’, a specialized exhibition for total solutions in electronics manufacturing. ‘SMART SMT PCB ASSEMBLY’ goes beyond SMT and PCB assembly processes to cover semiconductor packaging and manufacturing automation systems, providing a platform where the latest technologies and innovative production solutions in the electronics manufacturing industry can be experienced in one place.

At this exhibition, PARMI will showcase a range of equipment to demonstrate the reliability and accuracy of its products. Through live equipment demonstrations at the booth, the company plans to present its advanced technologies and solutions directly to customers.

• SigmaX : 3D SPI
• Xceed : 3D AOI
• Xceed MICRO : 3D AOI for Semiconductor Packaging
• Xceed BSI : Bottom Side Inspection 3D AOI
• PCI 100 : Conformal Coating Inspection 3D AOI (option : Coating Thickness Inspection)

PARMI’s Booth will be located in Hall I112.