PARMI to Exhibit at NEPCON JAPAN 2020

[Show Name] NEPCON JAPAN 2020 – R&D and Manufacturing
[Dates] January 15(Wed)-17(Fri), 2020 10:00-18:00 (last day until 17:00)
[Venue] Tokyo Big Sight, Japan
[Organizer] Reed Exhibitions Japan Ltd.
[PARMI Japan Booth Number] W1-30

PARMI Co., Ltd. is going to participate in the ‘NEPCON JAPAN 2020’, Asia’s leading exhibition featuring all kinds of equipment, materials and technologies for electronics manufacturing and SMT.

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor) and PCI 100 DSI(2D/3D conformal coating inspection), Xceed DSI(Double Side Inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at W1-30.