[Show Name] Nepcon Japan 2023
[Dates] January 25(Wed)-27(Fri), 2023 09:00-18:00 (last day until 16:00)
[Venue] Tokyo Big Sight, Japan
[Organizer] Reed Exhibitions Japan Ltd.
[Booth Number] East Hall 16-2
PARMI Japan is going to participate in the ‘Nepcon Japan 2023’, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology.
- SigmaX : 3D SPI (Solder Pasted Inspection)
- Xceed : 3D AOI (Automatic Optical Inspection)
- Xceed MICRO : 3D AOI for semiconductor packaging
- Xceed DSI : Double side inspection 3D AOI
PARMI’s booth will be located at 16-2.