PARMI to Exhibit at NEPCON ASIA 2021

[Show Name] NEPCON ASIA 2021
[Dates] October 20(Wed)-22(Fri), 2021
[Venue] Shenzhen World Exhibition & Convention Center, China
[Organizer] Reed Exhibitions China Ltd.
[PARMI China Booth Number] 1C10

PARMI Co., Ltd. is going to participate in the ‘NEPCON ASIA 2021’,  Asia’s leading exhibition featuring all kinds of equipment, materials and technologies for electronics manufacturing and SMT.

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), and Xceed MICRO(3D AOI for Semiconductor) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at 1C10.