PARMI to Exhibit at NEPCON CHINA 2021

[Show Name] NEPCON CHINA 2021
[Dates] April 21(Wed)-23(Fri), 2021
[Venue] Shanghai World Expo Exhibition & Convention Center, China
[Organizer] Reed Exhibitions China Ltd.
[PARMI China Booth Number] 1H-30

PARMI Co., Ltd. is going to participate in the ‘NEPCON CHINA 2021’, Asia’s leading exhibition featuring all kinds of equipment, materials and technologies for electronics manufacturing and SMT.

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor) and PCI 100(2D/3D conformal coating inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at 1H-30.